A research group has made a significant breakthrough in the mass production of extremely thin and flexible diamond membranes.
A team of researchers led by Professor Zhiqin Chu, an Associate Professor in the Department of Electrical & Electronic Engineering, alongside Professor Yuan Lin from the Department of Mechanical Engineering at the University of Hong Kong (HKU), has created a pioneering method for large-scale production of ultrathin and ultra-flexible diamond membranes. They collaborated with Professor Kwai Hei Li, an Assistant Professor at the Southern University of Science and Technology, and Professor Qi Wang from the Dongguan Institute of Opto-Electronics at Peking University.
These incredibly thin and flexible diamond membranes are compatible with current semiconductor fabrication methods, making it possible to create a wide range of electronic, photonic, mechanical, acoustic, and quantum devices.
The team’s novel edge-exposed exfoliation technique allows for rapid and scalable production of independent diamond membranes. This new method is much more efficient than traditional approaches, which tend to be time-consuming, expensive, and constrained in size. Notably, this innovative process can produce a two-inch wafer in just 10 seconds, providing unmatched speed and scalability.
The ultra-flat surface of these diamond membranes is crucial for high-precision micromanufacturing. Their flexibility also paves the way for the development of next-gen flexible and wearable electronic and photonic technologies. The research group anticipates considerable industrial opportunities in electronics, photonics, mechanics, thermics, acoustics, and quantum tech.
“We aim to enhance the application of high-quality diamond membranes across various sectors and to commercialize this advanced technology, setting a new benchmark in the semiconductor field. We are eager to partner with both academic institutions and industries to launch this revolutionary product and expedite the onset of the diamond era,” stated Professor Chu.
Diamonds are not only valued as gemstones but also offer remarkable versatility in scientific and engineering fields. Known as the hardest natural substance, diamonds have excellent thermal conduction at room temperature, very high carrier mobility, significant dielectric breakdown strength, an extensive bandgap, and optical transparency extending from the infrared to deep ultraviolet light. These outstanding characteristics make diamonds highly suitable for building cutting-edge, high-power, high-frequency electronic components, photonic devices, and efficient heat spreaders for cooling high-power electronics such as processors, semiconductor lasers, and electric vehicles. Nonetheless, the inert characteristics and rigid crystal structure of diamonds present challenges in their fabrication and mass production, particularly when it comes to ultrathin and freestanding diamond membranes, which limits their extensive application.
